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CM1224
PACKAGE DIMENSIONS
SOT ? 143
CASE 318A ? 06
ISSUE U
D
e
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
A
D
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIM-
UM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE
MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PRO-
E1
E
GAUGE
PLANE
L2
L
DETAIL A
SEATING
PLANE
TRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS,
AND GATE BURRS SHALL NOT EXCEED 0.25 PER SIDE.
DIMENSION E1 DOES NOT INCLUDE INTERLEAD FLASH OR
PROTRUSION. INTERLEAD FLASH AND PROTRUSION SHALL
NOT EXCEED 0.25 PER SIDE.
5. DIMENSIONS D AND E1 ARE DETERMINED AT DATUM H.
6. DATUMS A AND B ARE DETERMINED AT DATUM H.
b1
e1
B
3X
b
DIM
A
MILLIMETERS
MIN MAX
0.80 1.12
TOP VIEW
0.20
M
C A-B D
A1
b
0.01 0.15
0.30 0.51
b1
0.76 0.94
c
0.10 C
H
c
c
D
E
E1
0.08 0.20
2.80 3.05
2.10 2.64
1.20 1.40
A
A1
SIDE VIEW
C
SEATING
PLANE
DETAIL A
END VIEW
e
e1
L
1.92 BSC
0.20 BSC
0.35 0.70
RECOMMENDED
SOLDERING FOOTPRINT*
1.92
L2
0.25 BSC
4X
0.75
0.20
0.96
2.70
3X
0.54
DIMENSIONS: MILLIMETERS
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
8
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